TY - GEN
T1 - Chip-to-chip inductive wireless power transmission system for SiP applications
AU - Onizuka, Kohei
AU - Kawaguchi, Hiroshi
AU - Takamiya, Makoto
AU - Kuroda, Tadahiro
AU - Sakurai, Takayasu
PY - 2006
Y1 - 2006
N2 - A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700×700μm on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed.
AB - A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700×700μm on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed.
UR - http://www.scopus.com/inward/record.url?scp=39049086242&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=39049086242&partnerID=8YFLogxK
U2 - 10.1109/CICC.2006.320994
DO - 10.1109/CICC.2006.320994
M3 - Conference contribution
AN - SCOPUS:39049086242
SN - 1424400767
SN - 9781424400768
T3 - Proceedings of the Custom Integrated Circuits Conference
SP - 575
EP - 578
BT - Proceedings of the IEEE 2006 Custom Integrated Circuits Conference, CICC 2006
T2 - IEEE 2006 Custom Integrated Circuits Conference, CICC 2006
Y2 - 10 September 2006 through 13 September 2006
ER -