TY - GEN
T1 - Cryogenic microshaping of viscoelastic polymer with single point diamond tool
AU - Yoshikawa, Shun
AU - Kakinuma, Yasuhiro
AU - Sato, Yohei
AU - Aoyama, Tojiro
PY - 2014/1/1
Y1 - 2014/1/1
N2 - Viscoelastic polymer, such as polydimethylsiloxane (PDMS), is extensively used as a substrate material of the micro fluidic chip. Generally, it is difficult to machine PDMS which performs adhesion and softness at the room temperature. However, applying the cryogenic machining which focuses on the glass transition phenomena of viscoelastic polymers, accurate cutting of PDMS becomes possible. In this study, in order to machine PDMS more efficiently and precisely, feasibility of cryogenic microshaping with non-rotational cutting tool was investigated experimentally.
AB - Viscoelastic polymer, such as polydimethylsiloxane (PDMS), is extensively used as a substrate material of the micro fluidic chip. Generally, it is difficult to machine PDMS which performs adhesion and softness at the room temperature. However, applying the cryogenic machining which focuses on the glass transition phenomena of viscoelastic polymers, accurate cutting of PDMS becomes possible. In this study, in order to machine PDMS more efficiently and precisely, feasibility of cryogenic microshaping with non-rotational cutting tool was investigated experimentally.
KW - Glass transition
KW - Micro fluidic chip
KW - Micromachining
KW - PDMS
UR - http://www.scopus.com/inward/record.url?scp=84923177459&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84923177459&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84923177459
T3 - Conference Proceedings - 14th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2014
SP - 75
EP - 78
BT - Conference Proceedings - 14th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2014
A2 - Leach, R.
PB - euspen
T2 - 14th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2014
Y2 - 2 June 2014 through 6 June 2014
ER -