TY - JOUR
T1 - Design and Fabrication of a Micropillar-Pumped Polymer Loop Heat Pipe
AU - Hashimoto, Masaaki
AU - Kawakami, Taiga
AU - Alasli, Abdulkareem
AU - Nomura, Ryobu
AU - Nagano, Hosei
AU - Ueno, Ai
N1 - Publisher Copyright:
© 1992-2012 IEEE.
PY - 2023/12/1
Y1 - 2023/12/1
N2 - This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling in the polymer LHP, with up to 34 °C reduction in evaporator temperature when compared to a non-fluid-charged state in a horizontal orientation.
AB - This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling in the polymer LHP, with up to 34 °C reduction in evaporator temperature when compared to a non-fluid-charged state in a horizontal orientation.
KW - Flexible electronics
KW - micropillar wick
KW - polymer loop heat pipe
KW - two-phase heat transfer
UR - https://www.scopus.com/pages/publications/85174854567
UR - https://www.scopus.com/pages/publications/85174854567#tab=citedBy
U2 - 10.1109/JMEMS.2023.3318413
DO - 10.1109/JMEMS.2023.3318413
M3 - Article
AN - SCOPUS:85174854567
SN - 1057-7157
VL - 32
SP - 519
EP - 521
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
IS - 6
ER -