Entangled chip removal utilizing mass-spring model with mobile manipulator

This study aims to automate the removal of entangled chips in manufacturing environments using a mobile manipulator. Despite advancements in factory automation technology, this task often necessitates manual intervention. Accordingly, this study proposes a deformable chip model (based on a reconfigurable mass-spring system per frame), incorporating visual chip tracking data and force reactions. Consequently, to evaluate the removal state, an efficient removal strategy is derived by defining the instantaneous stiffness and energy absorption rate. Validation of system performance through two removal tests demonstrates the feasibility of automating entangled chip removal, contributing to enhanced operational efficiency in fully automated production lines.