TY - GEN
T1 - Eye blink artifact rejection in single-channel electroencephalographic signals by complete ensemble empirical mode decomposition and independent component analysis
AU - Kanoga, Suguru
AU - Mitsukura, Yasue
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/11/4
Y1 - 2015/11/4
N2 - To study an eye blink artifact rejection scheme from single-channel electroencephalographic (EEG) signals has been now a major challenge in the field of EEG signal processing. High removal performance is still needed to more strictly investigate pattern of EEG features. This paper proposes a new eye blink artifact rejection scheme from single-channel EEG signals by combining complete ensemble empirical mode decomposition (CEEMD) and independent component analysis (ICA). We compare the separation performance of our proposed scheme with existing schemes (wavelet-ICA, EMD-ICA, and EEMD-ICA) though real-life data by using signal-to-noise ratio. As a result, CEEMD-ICA showed high performance (11.86 dB) than all other schemes (10.78, 10.59, and 11.30 dB) in the ability of eye blink artifact removal.
AB - To study an eye blink artifact rejection scheme from single-channel electroencephalographic (EEG) signals has been now a major challenge in the field of EEG signal processing. High removal performance is still needed to more strictly investigate pattern of EEG features. This paper proposes a new eye blink artifact rejection scheme from single-channel EEG signals by combining complete ensemble empirical mode decomposition (CEEMD) and independent component analysis (ICA). We compare the separation performance of our proposed scheme with existing schemes (wavelet-ICA, EMD-ICA, and EEMD-ICA) though real-life data by using signal-to-noise ratio. As a result, CEEMD-ICA showed high performance (11.86 dB) than all other schemes (10.78, 10.59, and 11.30 dB) in the ability of eye blink artifact removal.
UR - http://www.scopus.com/inward/record.url?scp=84953248977&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84953248977&partnerID=8YFLogxK
U2 - 10.1109/EMBC.2015.7318315
DO - 10.1109/EMBC.2015.7318315
M3 - Conference contribution
C2 - 26736215
AN - SCOPUS:84953248977
T3 - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
SP - 121
EP - 124
BT - 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2015
Y2 - 25 August 2015 through 29 August 2015
ER -