Fined-grained body biasing for frequency scaling in advanced SOI processes

Johannes Maximilian Kuhn; Hideharu Amano; Oliver Bringmann; Wolfgang Rosenstiel

doi:10.1109/CoolChips.2015.7158655

Fined-grained body biasing for frequency scaling in advanced SOI processes

Johannes Maximilian Kuhn, Hideharu Amano, Oliver Bringmann, Wolfgang Rosenstiel

情報工学科

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

New SOI processes offer unprecedented flexibility in regard to low-power and performance. The use of fine-grained body biasing in STMicro's 28nm UTBB-FDSOI is evaluated for a Dynamically Reconfigurable Processor design in a frequency scaling scenario. Three different strategies are evaluated for Processing Elements: Static, programmable and dynamic body biasing. Fine-grained body biasing significantly mitigates increased leakage currents of forward body biasing between 42.85% to 64.5% on average. This makes static body biasing a viable low-cost option and makes dynamic body biasing worthwhile even at short time periods.

本文言語	English
ホスト出版物のタイトル	IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings
出版社	Institute of Electrical and Electronics Engineers Inc.
ISBN（電子版）	9781467373258
DOI	https://doi.org/10.1109/CoolChips.2015.7158655
出版ステータス	Published - 2015 7月 14
イベント	18th IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 2015 - Yokohama, Japan 継続期間: 2015 4月 13 → 2015 4月 15

出版物シリーズ

名前	IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings

Other

Other	18th IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 2015
国/地域	Japan
City	Yokohama
Period	15/4/13 → 15/4/15

ASJC Scopus subject areas

ハードウェアとアーキテクチャ
電子工学および電気工学

文献へのアクセス

10.1109/CoolChips.2015.7158655

他のファイルとリンク

引用スタイル

Kuhn, J. M., Amano, H., Bringmann, O., & Rosenstiel, W. (2015). Fined-grained body biasing for frequency scaling in advanced SOI processes. In IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings 記事 7158655 (IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CoolChips.2015.7158655

Fined-grained body biasing for frequency scaling in advanced SOI processes. / Kuhn, Johannes Maximilian; Amano, Hideharu; Bringmann, Oliver その他.
IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. 7158655 (IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings).

研究成果: Conference contribution

Kuhn, JM, Amano, H, Bringmann, O & Rosenstiel, W 2015, Fined-grained body biasing for frequency scaling in advanced SOI processes. in IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings., 7158655, IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings, Institute of Electrical and Electronics Engineers Inc., 18th IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 2015, Yokohama, Japan, 15/4/13. https://doi.org/10.1109/CoolChips.2015.7158655

Kuhn JM, Amano H, Bringmann O, Rosenstiel W. Fined-grained body biasing for frequency scaling in advanced SOI processes. In IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2015. 7158655. (IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings). doi: 10.1109/CoolChips.2015.7158655

Kuhn, Johannes Maximilian ; Amano, Hideharu ; Bringmann, Oliver その他. / Fined-grained body biasing for frequency scaling in advanced SOI processes. IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. (IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings).

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abstract = "New SOI processes offer unprecedented flexibility in regard to low-power and performance. The use of fine-grained body biasing in STMicro's 28nm UTBB-FDSOI is evaluated for a Dynamically Reconfigurable Processor design in a frequency scaling scenario. Three different strategies are evaluated for Processing Elements: Static, programmable and dynamic body biasing. Fine-grained body biasing significantly mitigates increased leakage currents of forward body biasing between 42.85% to 64.5% on average. This makes static body biasing a viable low-cost option and makes dynamic body biasing worthwhile even at short time periods.",

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Fined-grained body biasing for frequency scaling in advanced SOI processes

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