Piezoresistive pressure sensor designed in the standard CMOS process is proposed. The device features the electrical separation by the pn-junction provided by the standard CMOS process, which it does not need any MEMS processes or the post-processes. The proposed device is composed of vertical multi-pn junctions, and two methods of 3-layer and 4-layer are considered with their advantages and drawbacks. It features high-temperature robustness with silicon material, and integrability to silicon devices. It is designed without any additional processes and therefore enables to compatible to the CMOS devices with low-cost and suitable for mass production that are favorable for IoT (Internet of Things) applications.
|IEEE Transactions on Circuits and Systems II: Express Briefs
|Published - 2023 2月 1
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