TY - GEN
T1 - Highly Sensitive Angular Accelerometer Utilizing Piezoresistive Cantilever and Spiral Liquid Channel
AU - Jo, Byeongwook
AU - Takahashi, Hidetoshi
AU - Takahata, Tomoyuki
AU - Shimoyama, Isao
N1 - Funding Information:
This work was partially supported by and Industrial Technology Development (NEDO).
Funding Information:
This work was partially supported by New Energy and Industrial Technology Development Organization (NEDO).
Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - This paper reports a highly sensitive angular accelerometer utilizing a piezoresistive cantilever and spiral liquid channels. The spiral structure increases the total inertial force of liquid due to angular acceleration, which leads to the sensitivity enhancement. The differential pressure between two spiral liquid channels was measured by a piezoresistive cantilever with the resolution of 0.01 Pa. The developed sensor with number of turns of the spiral with 25 achieved the sensitivity enhancement by 28.5 times, compared to the ring channel sensor.
AB - This paper reports a highly sensitive angular accelerometer utilizing a piezoresistive cantilever and spiral liquid channels. The spiral structure increases the total inertial force of liquid due to angular acceleration, which leads to the sensitivity enhancement. The differential pressure between two spiral liquid channels was measured by a piezoresistive cantilever with the resolution of 0.01 Pa. The developed sensor with number of turns of the spiral with 25 achieved the sensitivity enhancement by 28.5 times, compared to the ring channel sensor.
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U2 - 10.1109/MEMSYS.2019.8870806
DO - 10.1109/MEMSYS.2019.8870806
M3 - Conference contribution
AN - SCOPUS:85074337271
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 206
EP - 209
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -