TY - GEN
T1 - Hybrid integrated light sources on silicon assembled by transfer printing
AU - Ota, Yasutomo
AU - Iwamoto, Satoshi
AU - Arakawa, Yasuhiko
N1 - Funding Information:
This work was supported by JSPS KAKENHI Grant-in-Aid for Specially Promoted Research (15H05700), KAKENHI (19K05300), JST PRESTO (JPMJPR1863) and a project of NEDO (JPNP13004).
Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - We will discuss the hybrid integration of micro/nanoscale light sources on silicon photonics circuits with transfer printing, which is based on pick-and-place assembly using a viscoelastic stamp. Various light sources including quantum-dot single-photon sources are readily and flexibly integrated on silicon with high positioning accuracy.
AB - We will discuss the hybrid integration of micro/nanoscale light sources on silicon photonics circuits with transfer printing, which is based on pick-and-place assembly using a viscoelastic stamp. Various light sources including quantum-dot single-photon sources are readily and flexibly integrated on silicon with high positioning accuracy.
KW - photonic hybrid integration
KW - silicon photonics
KW - single photon sources
KW - transfer printing
UR - http://www.scopus.com/inward/record.url?scp=85123211816&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85123211816&partnerID=8YFLogxK
U2 - 10.1109/IPC48725.2021.9592909
DO - 10.1109/IPC48725.2021.9592909
M3 - Conference contribution
AN - SCOPUS:85123211816
T3 - 2021 IEEE Photonics Conference, IPC 2021 - Proceedings
BT - 2021 IEEE Photonics Conference, IPC 2021 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE Photonics Conference, IPC 2021
Y2 - 18 October 2021 through 21 October 2021
ER -