Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.
|出版ステータス||Published - 2005 12月 1|
|イベント||3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 - Nagoya, Japan|
継続期間: 2005 10月 19 → 2005 10月 22
|Other||3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005|
|Period||05/10/19 → 05/10/22|
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