Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

Xijun Kang; Jim'ichi Tamaki; Akihiko Kubo; Jiwang Yan; Toshirou Iyama

Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

Xijun Kang, Jim'ichi Tamaki, Akihiko Kubo, Jiwang Yan, Toshirou Iyama

研究成果: Paper › 査読

抄録

Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

本文言語	English
ページ	193-198
ページ数	6
出版ステータス	Published - 2005 12月 1
外部発表	はい
イベント	3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 - Nagoya, Japan 継続期間: 2005 10月 19 → 2005 10月 22

Other

Other	3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005
国/地域	Japan
City	Nagoya
Period	05/10/19 → 05/10/22

ASJC Scopus subject areas

産業および生産工学

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フィンガープリント

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引用スタイル

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title = "Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel",

abstract = "Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.",

keywords = "Cutting edge truncation, Metal-bonded grinding wheel, Optical material, Quartz, Silicon",

author = "Xijun Kang and Jim'ichi Tamaki and Akihiko Kubo and Jiwang Yan and Toshirou Iyama",

year = "2005",

month = dec,

day = "1",

language = "English",

pages = "193--198",

note = "3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 ; Conference date: 19-10-2005 Through 22-10-2005",

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TY - CONF

T1 - Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

AU - Kang, Xijun

AU - Tamaki, Jim'ichi

AU - Kubo, Akihiko

AU - Yan, Jiwang

AU - Iyama, Toshirou

PY - 2005/12/1

Y1 - 2005/12/1

N2 - Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

AB - Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

KW - Cutting edge truncation

KW - Metal-bonded grinding wheel

KW - Optical material

KW - Quartz

KW - Silicon

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EP - 198

T2 - 3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005

Y2 - 19 October 2005 through 22 October 2005

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