TY - GEN
T1 - Inductive-coupling interfaces for high-speed low-power proximity communications
AU - Chung, Hayun
AU - Kuroda, Tadahiro
PY - 2011
Y1 - 2011
N2 - Inductive-coupling interfaces provide high-speed, low-power and cost-efficient solutions in proximity communications. Synchronous pulse-based inductive-coupling transceivers have been applied to a wide range of applications, such as through-chip interface, non-contact memory and wafer-level testing.
AB - Inductive-coupling interfaces provide high-speed, low-power and cost-efficient solutions in proximity communications. Synchronous pulse-based inductive-coupling transceivers have been applied to a wide range of applications, such as through-chip interface, non-contact memory and wafer-level testing.
UR - https://www.scopus.com/pages/publications/80053621753
UR - https://www.scopus.com/pages/publications/80053621753#tab=citedBy
U2 - 10.1109/MWSCAS.2011.6026621
DO - 10.1109/MWSCAS.2011.6026621
M3 - Conference contribution
AN - SCOPUS:80053621753
SN - 9781612848570
T3 - Midwest Symposium on Circuits and Systems
BT - 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
T2 - 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
Y2 - 7 August 2011 through 10 August 2011
ER -