Inductive coupling thruchip interface for 3D integration

Engineering & Materials Science

• Silicon 100%
• Substrates 44%
• Communication 42%
• Electric fields 38%
• Magnetic fields 37%
• Networks (circuits) 35%
• Metals 27%
• Passivation 25%
• Oxide semiconductors 25%
• Eddy currents 22%
• Fusion reactions 17%
• Costs 16%
• Fabrication 15%

Physics & Astronomy

• chips 50%
• communication 26%
• silicon 25%
• coils 19%
• circuit protection 13%
• plots 12%
• performance 10%
• arts 9%
• electric fields 9%
• eddy currents 8%
• magnetic fields 7%
• passivity 7%
• emerging 7%
• fusion 6%
• costs 6%
• wafers 5%
• augmentation 4%
• fabrication 4%
• metals 4%