Interconnection and double layer for flexible electronic circuit with instant inkjet circuits

Tung Ta; Masaaki Fukumoto; Koya Narumi; Shigeki Shino; Yoshihiro Kawahara; Tohru Asami

doi:10.1145/2750858.2804276

Interconnection and double layer for flexible electronic circuit with instant inkjet circuits

Tung Ta
, Masaaki Fukumoto
, Koya Narumi
, Shigeki Shino
, Yoshihiro Kawahara
, Tohru Asami

研究成果: Conference contribution

22 被引用数 (Scopus)

抄録

Instant Inkjet Circuits by silver nano-particle ink realized home-brew electric circuit fabrication. However, current method can support only single-layered patterns, and conventional inter-layer connection methods are not suitable. In this paper, we will evaluate various easy-To-use inter-layer connection methods by making via holes, especially the ones made by different drilling mechanisms. We show that the felting needle is the best candidate as it can establish good conductivity immediately after nano-particle ink is printed into the hole, without using any curing process.

本文言語	English
ホスト出版物のタイトル	UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing
出版社	Association for Computing Machinery, Inc
ページ	181-190
ページ数	10
ISBN（電子版）	9781450335744
DOI	https://doi.org/10.1145/2750858.2804276
出版ステータス	Published - 2015 9月 7
外部発表	はい
イベント	3rd ACM International Joint Conference on Pervasive and Ubiquitous Computing, UbiComp 2015 - Osaka, Japan 継続期間: 2015 9月 7 → 2015 9月 11

出版物シリーズ

名前	UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing

Other

Other	3rd ACM International Joint Conference on Pervasive and Ubiquitous Computing, UbiComp 2015
国/地域	Japan
City	Osaka
Period	15/9/7 → 15/9/11

ASJC Scopus subject areas

コンピュータネットワークおよび通信
ハードウェアとアーキテクチャ
ソフトウェア

文献へのアクセス

10.1145/2750858.2804276

他のファイルとリンク

引用スタイル

Ta, T., Fukumoto, M., Narumi, K., Shino, S., Kawahara, Y., & Asami, T. (2015). Interconnection and double layer for flexible electronic circuit with instant inkjet circuits. In UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing (pp. 181-190). (UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing). Association for Computing Machinery, Inc. https://doi.org/10.1145/2750858.2804276

Interconnection and double layer for flexible electronic circuit with instant inkjet circuits. / Ta, Tung; Fukumoto, Masaaki; Narumi, Koya その他.
UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing. Association for Computing Machinery, Inc, 2015. p. 181-190 (UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing).

研究成果: Conference contribution

Ta, T, Fukumoto, M, Narumi, K, Shino, S, Kawahara, Y & Asami, T 2015, Interconnection and double layer for flexible electronic circuit with instant inkjet circuits. in UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing. UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing, Association for Computing Machinery, Inc, pp. 181-190, 3rd ACM International Joint Conference on Pervasive and Ubiquitous Computing, UbiComp 2015, Osaka, Japan, 15/9/7. https://doi.org/10.1145/2750858.2804276

Ta T, Fukumoto M, Narumi K, Shino S, Kawahara Y, Asami T. Interconnection and double layer for flexible electronic circuit with instant inkjet circuits. In UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing. Association for Computing Machinery, Inc. 2015. p. 181-190. (UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing). doi: 10.1145/2750858.2804276

Ta, Tung ; Fukumoto, Masaaki ; Narumi, Koya その他. / Interconnection and double layer for flexible electronic circuit with instant inkjet circuits. UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing. Association for Computing Machinery, Inc, 2015. pp. 181-190 (UbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing).

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abstract = "Instant Inkjet Circuits by silver nano-particle ink realized home-brew electric circuit fabrication. However, current method can support only single-layered patterns, and conventional inter-layer connection methods are not suitable. In this paper, we will evaluate various easy-To-use inter-layer connection methods by making via holes, especially the ones made by different drilling mechanisms. We show that the felting needle is the best candidate as it can establish good conductivity immediately after nano-particle ink is printed into the hole, without using any curing process.",

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Interconnection and double layer for flexible electronic circuit with instant inkjet circuits

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出版物シリーズ

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ASJC Scopus subject areas

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