TY - GEN
T1 - Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages
AU - Shishido, Nobuyuki
AU - Matsumoto, Satoru
AU - Chen, Chuantong
AU - Sato, Hisashi
AU - Omiya, Masaki
AU - Kamiya, Shoji
AU - Nishida, Masahiro
AU - Nokuo, Takeshi
AU - Nagasawa, Tadahiro
AU - Suzuki, Takashi
AU - Nakamura, Tomoji
PY - 2011
Y1 - 2011
N2 - Capability of detecting local interface strength variation with 10 μm scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO2 with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m2.
AB - Capability of detecting local interface strength variation with 10 μm scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO2 with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m2.
UR - https://www.scopus.com/pages/publications/84861541506
UR - https://www.scopus.com/pages/publications/84861541506#tab=citedBy
U2 - 10.1115/IPACK2011-52270
DO - 10.1115/IPACK2011-52270
M3 - Conference contribution
AN - SCOPUS:84861541506
SN - 9780791844618
T3 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
BT - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
T2 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Y2 - 6 July 2011 through 8 July 2011
ER -