Low-loss design and fabrication of multimode polymer optical waveguide circuit with crossings for high-density optical PCB

Takaaki Ishigure, Keishiro Shitanda, Takuya Kudo, Shotaro Takayama, Tetsuya Mori, Kimio Moriya, Koji Choki

研究成果: Conference contribution

23 被引用数 (Scopus)

抄録

In this paper, we both theoretically and experimentally demonstrate that 90 % lower optical loss is realized with multimode crossed polymer optical waveguides by introducing graded-index (GI) cores, compared to conventional step-index (SI) core counterparts. First, the light leakage losses of crossed waveguides with SI and GI cores are simulated using a ray-trace simulation. Then, we show that a drastic reduction of the leakage loss is achieved in the GI-core crossed waveguide (only a loss of 0.095 dB for 50 perpendicular crossings), which is less than one-tenth of the leakage loss in the SI-core crossed waveguide (2.5-dB loss for the same 50 perpendicular crossings). Furthermore, even in the GI-core crossed waveguide with a 30-degree crossing angle, the leakage-loss is calculated to be only 0.009 dB/crossing, while 0.086 dB/crossing for the SI-core. This low loss of GI crossed core waveguides stems from the tight optical-field confinement in GI cores. Next, we confirm the validity of the calculated results. We fabricate the GI-core polymer crossed waveguides (multiple crossings) using the photo-address method for the first time to the best of our knowledge. In this method, we use a polynorbornene resin whose refractive index could be controlled by intensity variations of UV exposure during the curing process. The experimental results in the crossed waveguide with GI profile show a very good agreement with the calculated result.

本文言語English
ホスト出版物のタイトル2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
ページ297-304
ページ数8
DOI
出版ステータスPublished - 2013 9月 9
イベント2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
継続期間: 2013 5月 282013 5月 31

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
国/地域United States
CityLas Vegas, NV
Period13/5/2813/5/31

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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