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Low temperature boron activation in amorphous germanium for three dimensional integrated circuits (3D-ICs) using Ni-induced crystallization

  • Jin Hong Park
  • , M. Tada
  • , H. Y. Yu
  • , D. Kuzum
  • , Y. Na
  • , K. C. Saraswat

研究成果: Conference contribution

抄録

In this work, we present very low temperature boron activation technique in amorphous (α)-Ge using Ni-induced crystallization. Ni not only successfully crystallize α-Ge film, it also facilitates activation of the respective boron atoms in the α-Ge during the crystallization process at temperatures as low as 360°C. The feasibility of the low temperature activation technique has successfully been demonstrated for a Ge gate electrode in a Si PMOSFET using Schottky Ni silicide source/drain.

本文言語English
ホスト出版物のタイトルECS Transactions - SiGe, Ge, and Related Compounds 3
ホスト出版物のサブタイトルMaterials, Processing, and Devices
出版社Electrochemical Society Inc.
ページ909-916
ページ数8
版10
ISBN(印刷版)9781566776561
DOI
出版ステータスPublished - 2009
外部発表はい
イベント3rd SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 214th ECS Meeting - Honolulu, HI, United States
継続期間: 2008 10月 12 → 2008 10月 17

出版物シリーズ

名前ECS Transactions
番号10
巻16
ISSN(印刷版)1938-5862
ISSN(電子版)1938-6737

Conference

Conference3rd SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 214th ECS Meeting
国/地域United States
CityHonolulu, HI
Period08/10/12 → 08/10/17

ASJC Scopus subject areas

  • 工学一般

フィンガープリント

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