TY - GEN
T1 - Measurement of an airflow velocity change using a cantilever with Pb(Zr, Ti)O3
AU - Tomimatsu, Yutaka
AU - Takahashi, Hidetoshi
AU - Kuwana, Kenta
AU - Kobayashi, Takeshi
AU - Matsumoto, Kiyoshi
AU - Shimoyama, Isao
AU - Itoh, Toshihiro
AU - Maeda, Ryutaro
PY - 2013
Y1 - 2013
N2 - We proposed a thin piezoelectric cantilever to measure an airflow velocity change. An airflow sensor using a PZT cantilever and a flow channel was fabricated. We measured the relationship between the airflow velocity change and the piezoelectric voltage of the cantilever. The dimensions of the sensor and the cantilever are 25 mm × 20 mm × 20 mm and 1500 μm × 1000 μm × 2 μm respectively. We evaluated the effect of the diameter of the flow channel on the sensor response. It was demonstrated that the fabricated sensor generated an output voltage of several millivolts when the airflow velocity changed at a rate of approximately 1 m/s. It was observed that the output voltage increased as the diameter of the flow channel became small.
AB - We proposed a thin piezoelectric cantilever to measure an airflow velocity change. An airflow sensor using a PZT cantilever and a flow channel was fabricated. We measured the relationship between the airflow velocity change and the piezoelectric voltage of the cantilever. The dimensions of the sensor and the cantilever are 25 mm × 20 mm × 20 mm and 1500 μm × 1000 μm × 2 μm respectively. We evaluated the effect of the diameter of the flow channel on the sensor response. It was demonstrated that the fabricated sensor generated an output voltage of several millivolts when the airflow velocity changed at a rate of approximately 1 m/s. It was observed that the output voltage increased as the diameter of the flow channel became small.
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M3 - Conference contribution
AN - SCOPUS:84883111875
SN - 9781467344777
T3 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
BT - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
T2 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
Y2 - 16 April 2013 through 18 April 2013
ER -