TY - GEN
T1 - MuCCRA4-BB
T2 - 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016
AU - Kuhn, Johannes Maximilian
AU - Ben Ahmed, Akram
AU - Okuhara, Hayate
AU - Amano, Hideharu
AU - Bringmann, Oliver
AU - Rosenstiel, Wolfgang
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/7/5
Y1 - 2016/7/5
N2 - The partitioning, implementation and in-silicon leakage evaluation of MuCCRA4-BB proved the feasibility and validity of fine-grained BB. Furthermore, it demonstrated the superiority over coarse- and chip-grained BB, minimizing FBB leakage penalty and allowing far more RBB usage in all applications and scenarios. As leakage exacerbates in smaller geometries, fine-grained BB might be an answer with sensible overhead.
AB - The partitioning, implementation and in-silicon leakage evaluation of MuCCRA4-BB proved the feasibility and validity of fine-grained BB. Furthermore, it demonstrated the superiority over coarse- and chip-grained BB, minimizing FBB leakage penalty and allowing far more RBB usage in all applications and scenarios. As leakage exacerbates in smaller geometries, fine-grained BB might be an answer with sensible overhead.
UR - http://www.scopus.com/inward/record.url?scp=84982806248&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84982806248&partnerID=8YFLogxK
U2 - 10.1109/CoolChips.2016.7503676
DO - 10.1109/CoolChips.2016.7503676
M3 - Conference contribution
AN - SCOPUS:84982806248
T3 - 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings
BT - 19th IEEE Symposium on Low-Power and High-Speed Chips, IEEE COOL Chips 2016 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 20 April 2016 through 22 April 2016
ER -