Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

Yuan Yuxiang; Yoichi Yoshida; Tadahiro Kuroda

doi:10.1109/ASSCC.2007.4425745

Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

Yuan Yuxiang
, Yoichi Yoshida
, Tadahiro Kuroda

研究成果: Conference contribution

23 被引用数 (Scopus)

抄録

This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10% peak efficiency and 36mW power transmission. Compared with previous published chip-tochip wireless power transmission systems, the received power is 13 times larger.

本文言語	English
ホスト出版物のタイトル	2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
ページ	115-118
ページ数	4
DOI	https://doi.org/10.1109/ASSCC.2007.4425745
出版ステータス	Published - 2007 12月 1
イベント	2007 IEEE Asian Solid-State Circuits Conference, A-SSCC - Jeju, Korea, Republic of 継続期間: 2007 11月 12 → 2007 11月 14

出版物シリーズ

名前	2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

Other

Other	2007 IEEE Asian Solid-State Circuits Conference, A-SSCC
国/地域	Korea, Republic of
City	Jeju
Period	07/11/12 → 07/11/14

ASJC Scopus subject areas

ハードウェアとアーキテクチャ
電子工学および電気工学

文献へのアクセス

10.1109/ASSCC.2007.4425745

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引用スタイル

Yuxiang, Y, Yoshida, Y & Kuroda, T 2007, Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS. in 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC., 4425745, 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC, pp. 115-118, 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC, Jeju, Korea, Republic of, 07/11/12. https://doi.org/10.1109/ASSCC.2007.4425745

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abstract = "This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10\% peak efficiency and 36mW power transmission. Compared with previous published chip-tochip wireless power transmission systems, the received power is 13 times larger.",

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Y1 - 2007/12/1

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AB - This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-μm CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700μmx700μm on-chip inductors, the test chip achieves 10% peak efficiency and 36mW power transmission. Compared with previous published chip-tochip wireless power transmission systems, the received power is 13 times larger.

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M3 - Conference contribution

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SN - 9781424413607

T3 - 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

SP - 115

EP - 118

BT - 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

T2 - 2007 IEEE Asian Solid-State Circuits Conference, A-SSCC

Y2 - 12 November 2007 through 14 November 2007

ER -

Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

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出版物シリーズ

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