TY - GEN
T1 - Simultaneous 6Gb/s data and 10mW power transmission using nested clover coils for non-contact memory card
AU - Yuan, Yuxiang
AU - Radecki, Andrzej
AU - Miura, Noriyuki
AU - Aikawa, Iori
AU - Take, Yasuhiro
AU - Ishikuro, Hiroki
AU - Kuroda, Tadahiro
PY - 2010
Y1 - 2010
N2 - This paper presents a non-contact memory card and a host employing simultaneous data and power transmission through inductive coupling. Nested clover-shaped data coils are proposed for reducing interference from a power link. The host wirelessly tracks current consumption of the card and adjusts transmit power to improve power transfer efficiency. The prototype is implemented in 65nm CMOS. It achieves 6Gb/s data rate and almost 10% power transfer efficiency over a 100-2kΩ range of the load.
AB - This paper presents a non-contact memory card and a host employing simultaneous data and power transmission through inductive coupling. Nested clover-shaped data coils are proposed for reducing interference from a power link. The host wirelessly tracks current consumption of the card and adjusts transmit power to improve power transfer efficiency. The prototype is implemented in 65nm CMOS. It achieves 6Gb/s data rate and almost 10% power transfer efficiency over a 100-2kΩ range of the load.
UR - https://www.scopus.com/pages/publications/77958017983
UR - https://www.scopus.com/pages/publications/77958017983#tab=citedBy
U2 - 10.1109/VLSIC.2010.5560298
DO - 10.1109/VLSIC.2010.5560298
M3 - Conference contribution
AN - SCOPUS:77958017983
SN - 9781424476367
T3 - IEEE Symposium on VLSI Circuits, Digest of Technical Papers
SP - 199
EP - 200
BT - 2010 Symposium on VLSI Circuits, VLSIC 2010
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th Symposium on VLSI Circuits, VLSIC 2010
Y2 - 16 June 2010 through 18 June 2010
ER -