抄録
A La2O3 gate insulator was prepared via LaOF on a silicon substrate to suppress the interface reaction between the gate insulator and silicon substrate. LaOF was formed by heating the precursor solution containing La(NO3)3, acetylacetone and trifluoroacetic acid at 400-700°C in N2. By heating LaOF film at 700°C for 30 min in air, fluorine eliminated completely and La2O3 was formed. But silicon-oxide was formed at interface between LaOF heated at 400°C in N2 and the silicon substrate. To suppress the interface reaction, preparation of the fluoride on silicon will be needed.
本文言語 | English |
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ページ(範囲) | 259-262 |
ページ数 | 4 |
ジャーナル | Key Engineering Materials |
巻 | 228-229 |
出版ステータス | Published - 2002 1月 1 |
イベント | Asian Ceramic Science for Electronics II Proceedings of the 2nd Asian Meeting of Electroceramics - Kawasaki, Japan 継続期間: 2001 10月 1 → 2001 10月 1 |
ASJC Scopus subject areas
- 材料科学(全般)
- 材料力学
- 機械工学