TY - JOUR
T1 - Stripe formation in repulsive 4-leg Hubbard ladder
T2 - Directly-extended DMRG studies
AU - Machida, M.
AU - Yamada, S.
AU - Okumura, M.
AU - Ohashi, Y.
AU - Matsumoto, H.
PY - 2008/9/15
Y1 - 2008/9/15
N2 - In order to study the ground state of the Hubbard model from a slightly doped region to an over-doped one, we directly apply the density renormalization group method to 4-leg × 20-ladder repulsive Hubbard model and calculate hole distribution profiles with changing the on-site repulsion U / t from 0 to 15 and the doping ratio from 0.025 to 0.250. The calculation results in the underdoped range reveal that various stripe structures formed by doped holes merge or separate depending on U / t and the doping ratio. We suggest that these rich features are relevant to modulated hole distributions as experimentally observed in underdoped high-Tc superconductors.
AB - In order to study the ground state of the Hubbard model from a slightly doped region to an over-doped one, we directly apply the density renormalization group method to 4-leg × 20-ladder repulsive Hubbard model and calculate hole distribution profiles with changing the on-site repulsion U / t from 0 to 15 and the doping ratio from 0.025 to 0.250. The calculation results in the underdoped range reveal that various stripe structures formed by doped holes merge or separate depending on U / t and the doping ratio. We suggest that these rich features are relevant to modulated hole distributions as experimentally observed in underdoped high-Tc superconductors.
KW - Density-matrix renormalization group
KW - High-T superconductors
KW - Hubbard model
KW - Stripe
UR - http://www.scopus.com/inward/record.url?scp=50349086699&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50349086699&partnerID=8YFLogxK
U2 - 10.1016/j.physc.2008.05.269
DO - 10.1016/j.physc.2008.05.269
M3 - Article
AN - SCOPUS:50349086699
SN - 0921-4534
VL - 468
SP - 1141
EP - 1144
JO - Physica C: Superconductivity and its applications
JF - Physica C: Superconductivity and its applications
IS - 15-20
ER -