Thruchip interface for heterogeneous chip stacking

Keyphrases

• ThruChip Interface 100%
• Chip Stacking 100%
• Heterogeneous chip 100%
• Power Supply 40%
• Inductive Coupling 40%
• Wireless 20%
• Gbps 20%
• Supply Voltage 20%
• Energy Dissipation 20%
• Delay Time 20%
• Through Silicon via 20%
• Standard CMOS Technology 20%
• Device Sizing 20%
• Area-efficient 20%
• Discoidin Domain Receptor 1 (DDR1) 20%
• Downscaling 20%
• Interchip 20%
• Chip Thickness 20%
• Power Dissipation Efficiency 20%
• Circuit Solutions 20%
• Core Processor 20%
• Heterogeneous Integration 20%
• AC-coupled 20%
• Digital CMOS Circuit 20%

Engineering

• Energy Dissipation 100%
• Inductive Coupling 100%
• Power Supply 100%
• Delay Time 50%
• Supply Voltage 50%
• Chip Thickness 50%
• Device Scaling 50%