TY - GEN
T1 - ThruChip Interface (TCI) for 3D integration of low-power system
AU - Kuroda, Tadahiro
PY - 2010/12/1
Y1 - 2010/12/1
N2 - This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.
AB - This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.
UR - http://www.scopus.com/inward/record.url?scp=79951839481&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79951839481&partnerID=8YFLogxK
U2 - 10.1109/IEDM.2010.5703378
DO - 10.1109/IEDM.2010.5703378
M3 - Conference contribution
AN - SCOPUS:79951839481
SN - 9781424474196
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 17.1.1
BT - 2010 IEEE International Electron Devices Meeting, IEDM 2010
T2 - 2010 IEEE International Electron Devices Meeting, IEDM 2010
Y2 - 6 December 2010 through 8 December 2010
ER -