TY - GEN
T1 - Two-dimensional MEMS scanner for dual-axes confocal in vivo microscopy
AU - Ra, H.
AU - Taguchi, Y.
AU - Lee, D.
AU - Piyawattanametha, W.
AU - Solgaard, O.
PY - 2006/10/24
Y1 - 2006/10/24
N2 - This paper presents a two-dimensional (2-D) MicroElectroMechanical system (MEMS) scanner that enables dual-axes confocal microscopy. Dual-axes confocal microscopy provides high resolution in both transverse and axial directions, and is also well-suited for miniaturization and integration into endoscopes for in vivo imaging. A gimbaled MEMS scanner is fabricated on a double silicon-on-insulator (SOI) wafer (a silicon wafer bonded on a SOI wafer) and is actuated by self-aligned, vertical, electrostatic combdrives. The imaging capability of the MEMS mirror is successfully demonstrated in a breadboard setup. Reflectance images with a field of view (FOV) of 344 μm × 417 μm are achieved at 8 frames per second. The transverse resolution is 3.94 μm and 6.68 μm for the horizontal and vertical dimensions, respectively.
AB - This paper presents a two-dimensional (2-D) MicroElectroMechanical system (MEMS) scanner that enables dual-axes confocal microscopy. Dual-axes confocal microscopy provides high resolution in both transverse and axial directions, and is also well-suited for miniaturization and integration into endoscopes for in vivo imaging. A gimbaled MEMS scanner is fabricated on a double silicon-on-insulator (SOI) wafer (a silicon wafer bonded on a SOI wafer) and is actuated by self-aligned, vertical, electrostatic combdrives. The imaging capability of the MEMS mirror is successfully demonstrated in a breadboard setup. Reflectance images with a field of view (FOV) of 344 μm × 417 μm are achieved at 8 frames per second. The transverse resolution is 3.94 μm and 6.68 μm for the horizontal and vertical dimensions, respectively.
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M3 - Conference contribution
AN - SCOPUS:33748920611
SN - 0780394755
SN - 9780780394759
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 862
EP - 865
BT - 19th IEEE International Conference on Micro Electro Mechanical Systems
T2 - 19th IEEE International Conference on Micro Electro Mechanical Systems
Y2 - 22 January 2006 through 26 January 2006
ER -