TY - GEN
T1 - Ultrasonic-vibration-assisted micromachining of sapphire
AU - Wakabayashi, Hiroki
AU - Koike, Ryo
AU - Kakinuma, Yasuhiro
AU - Aoyama, Tojiro
AU - Shimada, Hiroyuki
AU - Hamada, Seiji
N1 - Publisher Copyright:
© 2016 Trans Tech Publications, Switzerland.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2016
Y1 - 2016
N2 - Sapphire is an attractive engineering material for the cover glass of smartphones and wristwatches because of its high hardness and resistance to corrosion, wear, and heat. However, the high rate of tool wear and brittle chippings around the holes are serious problems associated with drilling sapphire. To enhance the accuracy and efficiency of the drilling process on sapphire, this paper presents a novel tool-path strategy using helical milling along with various tool path patterns. Experimental results show that the proposed method successfully reduces brittle chippings around the holes.
AB - Sapphire is an attractive engineering material for the cover glass of smartphones and wristwatches because of its high hardness and resistance to corrosion, wear, and heat. However, the high rate of tool wear and brittle chippings around the holes are serious problems associated with drilling sapphire. To enhance the accuracy and efficiency of the drilling process on sapphire, this paper presents a novel tool-path strategy using helical milling along with various tool path patterns. Experimental results show that the proposed method successfully reduces brittle chippings around the holes.
KW - Micromachining
KW - Sapphire
KW - Ultrasonic vibration
UR - http://www.scopus.com/inward/record.url?scp=84991627884&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84991627884&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.874.247
DO - 10.4028/www.scientific.net/MSF.874.247
M3 - Conference contribution
AN - SCOPUS:84991627884
SN - 9783035710342
T3 - Materials Science Forum
SP - 247
EP - 252
BT - Advances in Abrasive Technology XIX
A2 - Krajnik, Peter
A2 - Krajnik, Peter
A2 - Rashid, Amir
A2 - Aoyama, Hideki
A2 - Xu, Xipeng
A2 - Wang, Jun
PB - Trans Tech Publications Ltd
T2 - 19th International Symposium on Advances in Abrasive Technology, ISAAT 2016
Y2 - 2 October 2016 through 5 October 2016
ER -