TY - JOUR
T1 - Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle
AU - Shiratori, Seimei Sha
AU - Mori, Seiji
AU - Ikezaki, Kazuo
N1 - Funding Information:
The authors thank Professor M.F. Rubner and Mr Michael Durstock of the Massachusetts Institute of Technology in the USA for their important advice and comments on this study. A part of this work was supported by a Grant-in-Aid from the Yazaki Foundation for the promotion of Science and Engineering.
PY - 1998/6/25
Y1 - 1998/6/25
N2 - Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.
AB - Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.
KW - Electropolymerization
KW - Micro-needle
KW - Polypyrrole
KW - Wire bonding
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U2 - 10.1016/S0925-4005(97)00338-9
DO - 10.1016/S0925-4005(97)00338-9
M3 - Article
AN - SCOPUS:0032089803
SN - 0925-4005
VL - 49
SP - 30
EP - 33
JO - Sensors and Actuators, B: Chemical
JF - Sensors and Actuators, B: Chemical
IS - 1-2
ER -