抄録
Electrically conducting wire of 10 - 200 μm width was formed freely over the electrically insulating substrate by `electropolymerization of conducting polymer using Scanning Microneedle'. The conductivity of the wire was estimated to be about 0.5-200 s/cm from the I-V characteristics and the value was not inferior to the reported conductivity of the electrochemically polymerized polypyrrole film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.
| 本文言語 | English |
|---|---|
| ページ | 269-272 |
| ページ数 | 4 |
| 出版ステータス | Published - 1997 1月 1 |
| イベント | Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2) - Chicago, IL, USA 継続期間: 1997 6月 16 → 1997 6月 19 |
Other
| Other | Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2) |
|---|---|
| City | Chicago, IL, USA |
| Period | 97/6/16 → 97/6/19 |
ASJC Scopus subject areas
- 工学（全般）