Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing

Yoichi Yoshida; Koichi Nose; Yoshihiro Nakagawa; Koichiro Noguchi; Yasuhiro Morita; Masamoto Tago; Tadahiro Kuroda; Masayuki Mizuno

doi:10.1109/ISSCC.2009.4977512

Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing

Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Tadahiro Kuroda, Masayuki Mizuno

研究成果: Conference contribution

19 被引用数 (Scopus)

本文言語	English
ホスト出版物のタイトル	2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	470-472
ページ数	3
ISBN（印刷版）	1424434580, 9781424434589
DOI	https://doi.org/10.1109/ISSCC.2009.4977512
出版ステータス	Published - 2009
イベント	2009 IEEE International Solid-State Circuits Conference ISSCC 2009 - San Francisco, CA, United States 継続期間: 2009 2月 8 → 2009 2月 12

出版物シリーズ

名前	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN（印刷版）	0193-6530

Other

Other	2009 IEEE International Solid-State Circuits Conference ISSCC 2009
国/地域	United States
City	San Francisco, CA
Period	09/2/8 → 09/2/12

ASJC Scopus subject areas

電子材料、光学材料、および磁性材料
電子工学および電気工学

文献へのアクセス

10.1109/ISSCC.2009.4977512

他のファイルとリンク

引用スタイル

Yoshida, Y., Nose, K., Nakagawa, Y., Noguchi, K., Morita, Y., Tago, M., Kuroda, T., & Mizuno, M. (2009). Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. In 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009 (pp. 470-472). 記事 4977512 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2009.4977512

Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. / Yoshida, Yoichi; Nose, Koichi; Nakagawa, Yoshihiro その他.
2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009. Institute of Electrical and Electronics Engineers Inc., 2009. p. 470-472 4977512 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

研究成果: Conference contribution

Yoshida, Y, Nose, K, Nakagawa, Y, Noguchi, K, Morita, Y, Tago, M, Kuroda, T & Mizuno, M 2009, Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. in 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009., 4977512, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, Institute of Electrical and Electronics Engineers Inc., pp. 470-472, 2009 IEEE International Solid-State Circuits Conference ISSCC 2009, San Francisco, CA, United States, 09/2/8. https://doi.org/10.1109/ISSCC.2009.4977512

Yoshida Y, Nose K, Nakagawa Y, Noguchi K, Morita Y, Tago M その他. Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. In 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009. Institute of Electrical and Electronics Engineers Inc. 2009. p. 470-472. 4977512. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). doi: 10.1109/ISSCC.2009.4977512

Yoshida, Yoichi ; Nose, Koichi ; Nakagawa, Yoshihiro その他. / Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009. Institute of Electrical and Electronics Engineers Inc., 2009. pp. 470-472 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

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